The DRS24C system provides the features necessary to handle a wide array of packaging designs, including BGA's, CSP's, Flip Chip, fine pitch QFP's, plastic sockets, PLCC's, BGA Sockets, BGA Connectors and surface mounted connectors.
Utlilzing a beam-splitter vision cube, this allows for simple alignment of component over pads. Green LEDs light component's spheres while white LEDs light the pads for optimum placement.
Motorized vision and Z-axis provide automatic component pick-up and removal. Automated placement of even the most sensitive devices is accomplished with the precision force measuring system.
Eight thermocouple channels provide comprehensive on-machine thermal profiling capability for process development. Thermal SMART Track is Air-Vac ’s award-winning process devel-opment software. One or more channels can be used during each rework cycle to monitor and control assembly temperature.
JBC JT-7000
The JT 7000 is for desoldering all types of SMD’s particulary QFPs and PLCCs of any size.
The station uses a system based on protector-extractors and hot-air flow, which makes desoldering clean and quick, while protecting the other components by concentrating the heat onto the IC.
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